Description
Date/Time: 04-24-2019 - Wednesday - 05:00 PM - 07:00 PM
Kwang-Un Jeong1 Hyeyoon Ko1 Dayoung Jung1 Minwoo Rim1 Seungchul Yang1 Geukcheon Bang1

1, Chonbuk National University, Jeonju, , Korea (the Republic of)

To develop an advanced thermal interface material (TIM) which can effectively dissipate the problematic heat in the electronic devices, rod-shaped reactive mesogen (RM) was newly synthesized as a building block for the thermally conductive liquid crystal (LC) films. Based on the combined techniques of spectroscopy, scattering and thermal analyses, it was verified that the synthesized RM formed a smectic A (SmA) mesophase between crystalline and isotropic (I) phases. The thermal conducting LC films were fabricated by the photopolymerization of RM in both LC and isotropic phases. Regardless of the molecular packing structures, the thermal conducting LC films exhibited outstanding heat transfer properties over 1 W/mK that surpass the conventional polymeric materials. In addition, the heat conducting performance of LC film can be amplified in a certain direction by the uniaxial orientation of LC molecules in the network. The uniaxially oriented LC film exhibited significant heat guiding performance as TIM than that of conventional organic materials. The highly thermal conducting LC films can be used as an advanced thermal managing material for electronic devices. This work was supported by BK21 Plus program, the BRL 2015042417, Mid-Career Researcher Program (2016R1A2B2011041).

Meeting Program