Date/Time: 04-23-2019 - Tuesday - 05:00 PM - 07:00 PM
Seshu Nimmala1 Aria Hosseini2 Jackson Harter3 Todd Palmer3 Eric Lenz1 Alex Greaney2

1, Lam Research Corporation, Tualatin, Oregon, United States
2, University of California, Riverside, Riverside, California, United States
3, Oregon State University, Corvallis, Oregon, United States

Thermal resistance across the interface between touching surfaces is critical for many industrial applications. Contacting interfaces are fractally rough, with locally intimate contact separated by regions with a wider gas filled boundary gap. Heat flow across the interface is heterogeneous and thus the contact model is based on a network of thermal resistors representing boundary resistance at local contacts and the access resistance for lateral transport to contacts. In a previous work [1], we developed a network model to predict the macroscopic thermal resistance of mechanically contacting surfaces. The results of molecular dynamics simulations to characterize boundary resistance of Silicon Alumina interfaces and the Boltzmann transport simulations of access resistance in Si in the ballistic transport regime were presented. In the present work, we review some of the current state-of-the-art and highlight the advanced models developed including surface characteristics such as roughness at interfaces. Additionally, we report some of the results of analyses when the components are subjected to variables such as pressure and temperature. This study is of practical significance in understanding the influence of surface roughness in thermal transport across interfaces at nanoscale to macroscale (i.e., multiscale) for applications such as thin films in the semiconductor industry, and mechanical components in industrial equipment.

1. Characterizing Macroscopic Thermal Resistance Across Contacting Interfaces Through Local Understanding of Thermal Transport, MRS Advances, Volume 3, Issue 44, 2018, pp. 2735-2741

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